Copper Heat Sink Substrate flat bottom pin type high power
electronic device Cu≥99.9%
Copper Heat Sink Substrate is a heat dissipating element made of
high thermal conductivity pure copper (Cu≥99.9%) or copper alloy
(such as C1100, C1020) as the core material through precision
machining (CNC cutting, stamping, welding, etc.). Mainly used for
thermal management of high power electronic devices (such as LED,
IGBT, CPU). According to the structure, it can be divided into Flat
Base and Pin-Fin, which are designed for different heat dissipation
requirements.
Flat bottom and needle type of copper cooling substrate
With its ultra-high thermal conductivity and customizable
construction, copper cooling substrates are the core components for
high power electronic cooling. The flat-bottom model is suitable
for compact thermal conductivity needs, while the pin model is
optimized for forced convection heat dissipation, and together they
cover thermal management scenarios from consumer electronics to
industrial scale.
| Characteristic | Flat Base | Pin type (PIN-FIN) |
| Structure | Flat surface, uniform thickness | Dense fins (height 5-50mm, spacing 1-5mm) |
| Heat dissipation mode | Conductor-based (contact heat conduction) | Convection dominated (increased surface area) |
| Application scenario | Direct chip mounting (e.g. LED, IC) | Forced air/liquid cooling systems (e.g. CPU heat sink) |
| Processing cost | Lower (CNC cutting or stamping) | High (to be welded or extruded) |
| Typical thermal resistance | 0.1-0.5℃/W (@1mm thickness) | 0.05-0.2℃/W (with fan) |
Characteristic of copper heat sink substrate
(1) Thermal conductivity
· Thermal conductivity ≥380W/(m·K), much higher than aluminum
(~200W/(m·K)), suitable for high heat density scenarios.
· The surface can be nickel-plated (Ni) or anti-oxidation treatment
to prevent copper oxidation leading to thermal resistance rise.
(2) Mechanical properties
· Tensile strength 200-350MPa, can be processed into a thin 0.3mm
soaking plate.
· High temperature resistance (long-term operating temperature
≤200℃), suitable for high-power devices.
(3) Structural design
· Flat bottom type: flat contact surface, suitable for direct
fitting with the chip (such as LED COB package).
· Pin type: Dense Fin (Pin-fin) structure, which increases the heat
transfer efficiency by increasing the surface area.
(4) Surface treatment
· Optional electroless nickel plating (ENIG), sandblasting or
antioxidant coating to meet different environmental requirements.
Application of copper heat sink substrate
(1) Power electronic heat dissipation
· LED lighting: Metal substrate (such as MCPCB) for high-power LED
modules to reduce junction temperature (Tj).
· IGBT module: copper-based radiator for electric vehicle
inverters, resistant to high temperature and humidity.
· Server CPU/GPU: High thermal conductivity copper base + heat pipe
heat dissipation solution.
(2) Optoelectronics and communication
· Laser diode (LD) : Copper tungsten (Cu-W) composite substrate to
solve the problem of thermal expansion coefficient (CTE) matching.
· 5G RF devices: Local heat dissipation enhancement of
high-frequency PA modules.
(3) Industrial and automotive electronics
· Power module: Soaking plate design of DC-DC converter.
· Battery Management System (BMS) : Copper cooling substrate for
fast charging pile.
Q&A
