Diamond Wire Multi-Wire High-Speed High-Precision Processing Hard
Brittle Materials
The diamond wire single/multi-wire high-speed high-precision
descending/swinging cutting machine is a composite processing
equipment for hard and brittle materials. By combining dynamic
grinding of diamond wire (steel wire coated with silicon
carbide/aluminum oxide particles) and multi-axis coordinated
control, it achieves high-precision cutting of ultra-hard
materials. Key design features include:
- Multi-wire cutting: Utilizes multiple diamond wires
simultaneously to enhance material utilization and efficiency.
- High-speed motion: Wire speed up to 2400 m/min, significantly
reducing processing time.
- High-precision control: Servo/stepper motor-driven with ±0.01
mm cutting accuracy.
- Swinging cutting: Worktable oscillates ±5°–±8° to optimize
surface flatness.
- Descending feed: Vertical movement of the workpiece or wire
minimizes material stress damage.
This equipment is widely used in semiconductors, photovoltaics,
ceramics, gemstones, and medical fields, particularly for cutting
silicon carbide (SiC), sapphire, monocrystalline silicon, and
quartz glass.
Diamond
wire/multi-wire/high-speed/high-precision/descending/oscillating
cutting machine technical specifications
| Parameter | Specification |
| Project | Multi-line wire saw with workbench on top |
| Maximum workpiece size | ø 204*500mm |
| Main roller coating diameter (Fixed at both ends) | ø 240*510mm (two main rollers) |
| Wire running speed | 2000 (MIX) m/min |
| Diamond wire diameter | 0.1-0.5mm |
| Line storage capacity of supply wheel | 20 (0.25 Diamond wire diameter) km |
| Cutting thickness range | 0.1-1.0mm |
| Cutting accuracy | 0.01mm |
| Vertical lifting stroke of workstation | 250mm |
| Cutting method | The material sways and descends from top to bottom, while the
position of the diamond line remains unchanged |
| Cutting feed speed | 0.01-10mm/min |
| Water tank | 300L |
| Cutting fluid | Anti-rust high-efficiency cutting fluid |
| Swing speed | 0.83°/s |
| Air pump pressure | 0.3-3MPa |
| Swing angle | ±8° |
| Maximum cutting tension | 10N-60N (Set minimum unit 0.1N) |
| Cutting depth | 500mm |
| Workstation | 1 |
| Power supply | Three-phase five-wire AC380V/50Hz |
| Total power of machine tool | ≤92kW |
| Main motor (Water circulation cooling) | 22*2kW |
| Wiring motor | 1*2kW |
| Workbench swing motor | 1.3*1kW |
| Tension control motor (Water circulation cooling) | 5.5*2kW |
| Wire release and collection motor | 15*2kW |
| External dimensions (excluding rocker arm box) | 1320*2644*2840mm |
| External dimensions (including rocker arm box) | 1780*2879*2840mm |
| Machine weight | 8000kg |
Diamond
wire/multi-wire/high-speed/high-precision/descending/oscillating
cutting machine working principle
The machine operates on "dynamic grinding of diamond wire +
multi-axis synchronization":
1. Diamond Wire Cycling:
- A high-speed rotating capstan drives diamond wire in
reciprocating or unidirectional motion.
- Tension wheels (pneumatic/spring-loaded) maintain wire tension
(0.1–1.0 MPa), while guide wheels ensure stability.
2. Material Feeding:
- Descending feed: Workpiece platform moves vertically at 0.01–10
mm/min, or wire actively presses against the workpiece.
- Swinging cutting: Worktable oscillates laterally (±15 mm
amplitude) to prolong contact time and improve surface roughness.
3. Multi-wire Coordination:
- Multiple diamond wires are synchronized via a tensioning system for
continuous cutting of large-sized materials (e.g., Φ300×300 mm
workpieces).
Diamond
wire/multi-wire/high-speed/high-precision/descending/oscillating
cutting machine key features & advantages
Feature
| Description
|
High Efficiency
| Multi-wire parallel processing + 2400 m/min speed, 300%
productivity gain
|
Ultra-High Precision
| Servo/stepper motors + ball screws ensure ±0.01 mm accuracy
|
Low Damage
| Descending feed + swinging motion minimize stress concentration,
<5 μm edge chipping
|
Intelligent Control
| PLC + touchscreen for program presetting, real-time monitoring, and
break-resume
|
Eco-Friendly
| Water-based cutting fluids reduce dust; noise <70 dB
|
Material Compatibility
| Processes materials ≤Mohs 9.5 hardness (diamond wire: hardness 10)
|
Diamond
wire/multi-wire/high-speed/high-precision/descending/oscillating
cutting machine application
1. Semiconductors & Photovoltaics:
- Silicon Wafer Slicing: Monocrystalline/multicrystalline silicon
ingot squaring/slicing (50–300 μm thickness) for solar cells and
ICs.
- SiC Wafer Cutting: High-purity SiC wafers for EV power devices,
<10% material loss.
2. Ceramics & Gemstones:
- Sapphire Processing: LED substrate and smartphone screen
slicing with ±0.02 mm thickness uniformity.
- Zirconia Ceramics: Mobile phone backplates and cutting tools
with Ra<1.6 μm surface roughness.
3. Quartz & Optical Glass:
- Quartz Crystals: Oscillator and sensor slicing (±0.01 mm
precision).
- Infrared Glass: Thermal imaging lens fabrication to avoid
thermal deformation.
4. Biomedical & Research:
- Orthopedic Implants: Hip joint and dental specimen slicing with
no thermal damage.
- Geological Thin Sections: 0.2–2 mm mineral slices preserving
original structure.
5. Composites & Metals:
- Carbon Fiber Composites: Aerospace component cutting with
<5% fiber breakage.
- Titanium Alloys: Medical device machining with 0.1–0.3 mm kerf
width.
Diamond
wire/multi-wire/high-speed/high-precision/descending/oscillating
cutting machine FAQ
1. Q: What are the core advantages of diamond wire dual-station
cutting machines?
A: High-speed dual-station design enables simultaneous
processing of two workpieces, doubling efficiency while maintaining
±0.01 mm precision for materials like silicon wafers and
ceramics.
2. Q: How does a diamond wire saw achieve "descending/swinging
cutting"?
A: It combines vertical feed systems (descending motion)
and oscillating worktables (±5°–8° swings) to reduce material
stress and improve surface flatness, ideal for brittle materials
like sapphire and SiC.
Tags: #Diamond Wire Cutting Machine, #Multi-Wire, #High-Speed, #High-Precision,#Descending, #Oscillatin,
#Hard Brittle Materials
