• High thermal conductivity, thermal conductivity > 450 W/K
• The thermal expansion number is well matched with Si, GaAs and GaN
• The density is relatively small, only 5.6-6.8 g/CML 3
• The surface is smooth and clean, and the surface roughness is < 0.4 μm
• It can be adjusted according to the customer's needs to adjust the gold and rigid stone content to achieve different properties
• The surface is easy to be plated with nickel and gold
  

Technical Parameters

1. Optical communication product packaging
2. COS tie piece sealing
3. T/R component packaging
4. Other heat sink

Our services

1. Factory direct manufacture and sell.

2. Fast, accurate quotes.

3. Reply to you within 24 working hours.

4. ODM: Customized design is avaliable.

5. Speed and precious delivery.

FAQ