CMP Grinding Plate Chemical Mechanical Polishing of Wafers
CMP Grinding Plates are core consumables in the Chemical
Mechanical Polishing (CMP) process. They are primarily used to condition and activate the polishing
pad surface, maintaining a stable polishing rate, achieving
wafer-scale nanoscale planarization, and directly impacting the
yield, cost, and productivity of semiconductor manufacturing.
CMP Grinding Plates interact with the polishing pad surface
through mechanical conditioning, removing polishing by-products
and glazed layers, restoring the pad's roughness and porosity. This ensures uniform distribution of polishing slurry and a
consistent Material Removal Rate (MRR). They are indispensable key components in advanced semiconductor
processes (e.g., copper interconnects, silicon vias, STI) .
CMP Grinding Plate Core Functions
1.Conditioning Polishing Pad Surface: Removes glazed layers and clogging materials from the pad
surface, restoring its roughness and open-cell structure to
maintain a stable polishing rate.
2.Controlling Polishing Uniformity: Ensures consistent morphology of the pad surface through
precise conditioning actions, preventing non-uniform polishing
(e.g., dishing, erosion) on the wafer surface.
3.Extending Polishing Pad Life: Regular conditioning reduces the frequency of pad replacement,
lowering production costs.
4.Reducing Defects: Optimizing conditioning parameters (e.g., pressure, rotational
speed) minimizes the risk of scratches, particle contamination,
and metal residue on the wafer surface.
CMP Grinding Plate Technical Features
| Feature Category | Specific Characteristics | Value Proposition |
| Material Innovation | Employs CVD diamond coatings, sintered abrasive technology
(e.g., 3M Trizact™ series), or ceramic composites (e.g.,
high-purity alumina)
| Achieves ultra-high hardness (Mohs 9+), high wear
resistance, and long service life |
| Structural Design | Micro-replicated surface textures (e.g., 3M Trizact™),
precise diamond placement (e.g., C-series), porous
structures, or custom geometries (e.g., bar, disc)
| Provides consistent conditioning performance, excellent
slurry distribution, and lower defect rates |
| Performance Advantages | Metal-free contamination (coatings can reduce metal leaching by
75%), low coefficient of thermal expansion, high chemical
stability, and adjustable stiffness
| Meets advanced node stringent requirements for purity, thermal
stability, and process consistency |
| Customization Capability | Supports diameter customization (e.g., 95mm to 600mm),
diamond grit selection (e.g., 74μm to 251μm), and base
material adaptation (stainless steel, ceramic polymer)
| Adapts to different CMP equipment (rotary, orbital) and process
needs (Cu, W, Si polishing) |
CMP Grinding Plate Types and Applications
1.Diamond Conditioning Disks:
- Features: Use CVD diamond or electroplated diamond as
abrasives, fixed to a stainless steel or ceramic base via
sintering, offering extremely high conditioning efficiency and
service life.
- Application: Primarily used in CMP processes for high-end
logic and memory chip manufacturing, such as copper barrier
layers (Barrier Cu) and Shallow Trench Isolation (STI).
2.Metal-Free Conditioning Brushes:
- Features: Use polymer or ceramic fiber bristles, are
metal-free, avoid ionic contamination, and are suitable for
metal-sensitive processes.
- Application: Often used for post-CMP cleaning of polishing
pads and light conditioning.
3.Composite Conditioning Disks:
- Features: Combine the conditioning power of diamond disks
and the low-defect characteristics of soft brushes, optimizing
defect rates through adjustable hardness and bristle shape.
- Application: Suitable for complex processes involving
multiple material polishing, such as advanced packaging and
3D integration.
CMP Grinding Plate Key Performance Parameters
Parameter Name | Typical Value/Range | Significance |
Diameter
| 95mm–600mm | Adapts the disk size to different CMP equipment |
Diamond Grit Size
| 74μm–251μm | Influences conditioning aggressiveness and surface roughness |
Base Material
| Stainless Steel, Ceramic, Polymer | Determines rigidity, corrosion resistance, and applicable processes |
Conditioning Life
| Up to hundreds of hours | Directly impacts consumable cost and equipment downtime |
Flatness
| ≤ 0.5μm | Ensures conditioning uniformity and wafer planarization results |
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Q1: What is the main purpose of a CMP grinding plate (conditioner
disk)?
A1: Its primary function is to resurface and activate the
polishing pad by removing glazed layers and debris, ensuring
consistent polishing rates and achieving global nanoscale
planarization of wafers during chemical mechanical polishing (CMP).
Q2: Why choose a silicon carbide (SiC) diamond grinding plate for
CMP?
A2: Silicon carbide diamond grinding plates offer exceptional
hardness (Mohs 9+), high wear resistance, thermal stability, and
chemical inertness, making them ideal for maintaining pad
roughness and extending service life in demanding semiconductor CMP
processes.
Tags: #CMP Grinding Plate, #Customized, #Chemical Mechanical Polishing of Wafers
