6inch JGS2 Wafer DSP 1mmt Product Display
6-inch JGS2 Quartz wafer Overview
The 6-inch JGS2 DSP (Double-Side Polished) wafer substrate with a
thickness of 1 mm is a high-precision base material fabricated from
UV-grade fused silica (JGS2). Its core value lies in the
exceptional optical transmittance of JGS2 across a broad spectral
range of 220 nm to 2500 nm (particularly suitable for UV to
near-infrared wavelengths). Furthermore, owing to its extremely
low coefficient of thermal expansion (approximately 5.8×10⁻⁷/K)
and high Mohs hardness (approximately grade 7), it maintains
outstanding dimensional stability and physical strength under harsh
conditions such as high temperatures and corrosive environments.
This substrate undergoes double-side polishing, achieving nanoscale
surface roughness. It is primarily used in high-end fields
including semiconductor photolithography, high-performance
optical filter substrates, photonic communication devices (e.g.,
DWDM filter chips), and MEMS sensors, providing a reliable
material foundation for precision optical systems.
Key Parameters of 6inch JGS2 Quartz Substrate
Parameter Category | Typical Values / Description |
Basic Specifications | Diameter: 6 inches (approx. 150 mm), Thickness: 1 mm, Material:
JGS2, Polishing: Double-Side Polishing (DSP) |
Optical Performance | Transmission Band: 220 nm - 2500 nm (UV to NIR), Average
Transmittance >85% in visible to NIR region |
Mechanical Properties | Density: ~2.2 g/cm³, Mohs Hardness: ~7, Young's Modulus: ~72 GPa |
Thermal Properties | Coefficient of Thermal Expansion: ~5.5×10⁻⁷/°C, Softening Point:
>1600°C |
Material Characteristics: JGS2 Fused Silica
JGS2 is a UV optical quartz glass produced via hydrogen-oxygen
flame fusion. Its core characteristics include:
- Excellent Optical Performance: JGS2 exhibits high transmittance
across a broad spectral range from 220 nm to 2500 nm, meaning
it allows light from ultraviolet to near-infrared to pass through
effectively. This makes it an ideal material for manufacturing
optical windows, lens substrates, and other components.
- Outstanding Thermal Stability: Its extremely low coefficient
of thermal expansion enables it to withstand drastic temperature
changes without cracking or deforming, ensuring dimensional
stability in high-temperature process environments.
- Good Mechanical Strength and Chemical Inertia: The high hardness
and Young's Modulus provide sufficient mechanical strength, while
its resistance to various chemicals (except hydrofluoric acid and
hot phosphoric acid) meets the demands of stringent industrial
environments.
6inch JGS2 Wafer Primary Application Scenarios
- Based on the above properties, this product is primarily applied
in:
- Semiconductor Processes: Used as a mask plate substrate or
carrier wafer in processes such as photolithography and etching,
where its high purity and thermal stability are crucial.
- Optical Component Manufacturing: Serves as a base material for
high-performance windows, prisms, and filters, especially suitable
for optical systems requiring UV transmission.
Photonic Communication Devices: Used in making filter
substrates for Dense Wavelength Division Multiplexing (DWDM)
systems, where optical homogeneity and low loss are key.
Q&A of 6inch JGS2 Wafer
Q1: What are the key advantages of using a 6-inch JGS2 DSP wafer
substrate with 1 mm thickness for UV optical applications?
A1: Its primary advantage lies in the exceptional UV
transmittance (down to 220 nm) and extremely low thermal expansion
coefficient (~5.5×10⁻⁷/°C), ensuring minimal thermal distortion
under high-power UV exposure and stable performance in demanding
environments like semiconductor lithography or laser systems.
Q2: How does the 1 mm thickness contribute to the substrate's
performance in high-precision systems?
A2: The 1 mm thickness provides an optimal balance between
mechanical strength (resisting handling stress) and optical
flatness, which is critical for maintaining beam coherence and
reducing wavefront distortion in precision optics and
photolithography tools.
Tags: #6Inch, #JGS2 Wafer, #Quartz Substrate, #DSP, #1mmt
thickness, #Fused Silica, #High-Performance Window
