6inch 1.0mm polished Aluminum Al2O3 Ceramic Substrate, High Thermal
Conductivity, Customized Al2O3 Ceramic,6inch ceramic substrates
A2O3 Introduce
Al2O3 substrate is the most popular ceramic substrate, with
excellent heat resistance,
high mechnical strength , abrasion resistance and small dielectric
loss .
The surface of alumina substrate is quite smooth and low porosity ,
99.6% alumina substrate
is suitable for thin film device , 96% alumina substrate is
suitable for thick film device application.
Surface Finishing Level:
a) Normal polish Ra 0.8-1.0μm
b) Fine polish Ra <5nm
c) Diamond polish Ra <1nm
Properties:
1. High Temperature Up to 1700℃
2. High Voltage Resistance
3. High Mechanical Strength and Hardness
4. Excellent Insulation Performance
5. High Corrosion Resistance
6. Extremly Abrasion Resistance Performance
7. Wide Scope of Application
| Properties | Units | Alumina(Al2O3) |
| Porous | Mullite | Al2O3 92% | Al2O3 96% | Al2O3 99% | Al2O3 99.6% |
| Al2O3 |
| Mechanical | Density | g/cm3 | | 2.8 | 3.6 | 3.7 | 3.9 | 3.9 |
| Color | —— | —— | Tan | White | White | Ivory | Ivory |
| Water Absorption | % | | 0 | 0 | 0 | 0 | 0 |
| Vickers Hardness | Gpa | —— | 7.4 | 11 | 11.5 | 13 | 14 |
| Flexural Strength (20°C) | Mpa | 50~100 | 170 | 345 | 358 | 380 | 380 |
| Compressive Strength (20°C) | Mpa | 20~100 | 550 | 2200 | 2300 | 3000 | 3000 |
| Thermal | Thermal Conductivity (20°C) | W/m.K | 3.1 | 3.5 | 16.7 | 24.8 | 25~35 | 25~35 |
| Thermal Shock Resistance (20°C) | ΔT(C) | —— | 300 | 250 | 250 | 200 | 200 |
| Maximum Use Temperature | °C | 1900 | 1700 | 1500 | 1600 | 1700 | 1700 |
| Electrical | Volume Resistivity (25°C) | Ω.cm | —— | >1014 | >1014 | >1014 | >1014 | >1014 |
Al2O3 Ceramic Feature ＆ Advantagement
| - Product Name: | Alumina / Al2O3 Ceramic Substrate For Thick Film Circuit /
5.5''x7.5'' |
| - Material: | 96% Alumina |
| - Typical Characteristics: | 1. Excellent Electrical Insulation 2. Good Thermal Shock Resistance 3. Corrosion Resistance 4. Good Flatness |
| - Typical Applications: | 1. Thick Film Hybrid Integrated Circuit 2. Ceramic Radiating Base for LED 3. Power Module 4. Semiconductor Device |
Application:
Electronical Vacuum decices, Cruibles, Insulation plates,
Capacitors, Spaceflights, Traffic,
Weave, Petro Chemical, Mine, Pharmaceutical Engineering,
Communication Engineering
and Archtectural, etc.
Our cooperating factory can applied the casting-tape process for
the manufacturing of
alumina substrate. With good thermal conductivity, insulation,
thermal shock resistance,
well resistance and anti-acid and
alkali etc., our ceramic substrates can be used in thick-film
hybrid integrated circuits (HIC),
LED ceramic radiating base, power module, semiconductor devices and
other fields.
We applied the casting-tape process for the manufacturing of
alumina substrate.
With good thermal conductivity, insulation, thermal shock
resistance, well resistance and
anti-acid and alkali etc., our ceramic substrates can be used in
thick-film hybrid integrated
circuits (HIC), LED ceramic radiating base, power module,
semiconductor devices and other fields.
Regular Size
| Thickness(mm) | lengthx width ( mm) |
| 0.385 |
2″* 2″ 50.8mm*50.8mm
|
3″* 3″ 76.2mm*76.2mm
| 4″* 4″ 101.6mm*101.6mm | 4.5″* 4.5″ 114.3mm*114.3mm |
| 0.5 |
| 0.635 |
| 1.0 |
| diameter(mm) |
| 1.0 | Φ16 Φ19 | Φ20 Φ26 | Φ30 Φ35 | Φ40 Φ45 | Φ50 Φ52 | Φ60 | Φ75 | Φ80 |
| 1.2 |
| 1.5 |
| 2.0 |
| 2.5 |
| | | | | | | | | | | |
| Diameter (mm) | Thickness (mm) |
2'' (50.8mm ) OF 16mm | 3'' (76.2mm) OF22mm | 4'' (100mm) OF 30mm | 5“ (125mm) OF 42.5mm | 6" (150mm) OF 47.5mm | 0.385 |
| 0.5 |
| 0.65 |
| 1.0 |
